Structure

PolyIC GmbH & Co. KG is a joint venture between Siemens AG, Division Automation & Drives, and LEONHARD KURZ Stiftung & Co. KG.

The birth of PolyIC took place in a research team in the division Corporate Technology within the Siemens AG, where the performance of polymers for integrated circuits could be demonstrated. The Siemens team of researchers constituted the core team with PolyIC, which was founded in November 2003. With LEONHARD KURZ Stiftung & Co. KG a specialist for printing, hot stamping and coating was found as an ideal partner to realize printed electronics.

The hot stamping specialist LEONHARD KURZ Stiftung & Co. KG in Fuerth, Bavaria (Germany) with its nine production facilities located throughout Europe, the US, and the Pacific region is a major international supplier and market leader of hot stamping and coating technology.

Siemens AG, Automation and Drives (A&D) is a worldwide leading manufacturer in the field of automation and drives technology. For over 20 years, Siemens A&D, the European market leader in industrial identification systems, has supplied RFID systems with a comprehensive portfolio for production, logistics and distribution.

LEONHARD KURZ Stiftung & Co. KG holds 51% in the joint venture PolyIC and Siemens AG 49%. Until March 2006, PolyIC was located in the research center of Siemens AG in Erlangen. Since April 2006, PolyIC has moved into an own building on the premises of LEONHARD KURZ Stiftung & Co. KG in Fuerth, which means that PolyIC is now in immediate proximity to the production facilities of the LEONHARD KURZ Stiftung & Co. KG. In the new building, PolyIC has enough space to develop printed electronics. This makes a fast development of products possible.