PolyIC was founded in November 2003 as a joint venture between LEONHARD KURZ Stiftung & Co. KG and Siemens AG.

The origins of the developments were placed in a team of the Corporate Technology of the electronics group Siemens in Erlangen. This team then formed the core of the newly founded PolyIC.

Leonhard KURZ Stiftung & Co. KG owned a 51% share and Siemens AG 49% in the joint venture PolyIC.

Until the end of March 2006, PolyIC was established on the research campus of Siemens AG in Erlangen. Since April 2006, PolyIC is located in a separate building on the site of Leonhard KURZ Stiftung & Co. KG and in close proximity to the production in Fuerth. This site offers PolyIC sufficient space for the development of printed electronics. This allows PolyIC to develop products rapidly and intensively.

Since 2010, Leonhard KURZ Stiftung & Co. KG owns 100% of the shares. KURZ is a worldwide leader in hot stamping and coating technology.