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Reliable Integration Solutions

A variety of techniques are suitable for integrating our PolyTC® sensor foils into your product. In the display industry, for example, lamination with OCA (Optical Clear Adhesives) has become established as a standard process in recent years. In addition to this, we also offer you other process classics such as self-adhesive labels, In-Mold Electronics (IME), etc. With the support of our parent company LEONHARD KURZ, the specialist for decoration processes, we are continuously working on optimizing our integration processes. The revolutionary FFB technology (Functional Foil Bonding) for example, enabled us to develop a cost-effective process that is especially suitable for the series integration of sensors into 3D-shaped components. Get an initial overview of our individual integration procedures here. Please do not hesitate to contact us if you have any further questions about the special techniques or would like to receive updates on our latest developments. Contact us.

Which Integration Method Suits Your Products?

Choosing the right integration method is a significant process in component production. Costs and requirements must be accurately weighed to find the appropriate method for your individual product. Are you satisfied with standard applications that can be implemented quickly and cost-effectively? Or does the intended use and place of use of your touch application require a long-lasting, robust connection between the sensor and the plastic part? Before you start planning, ask yourself these questions:

  • How long is the service life of my product?
  • Where is my product used (production, smart home, etc.)?
  • What external influences must my product be able to withstand (water, heat, etc.)?
  • Functionality, shape, design, or a combination? What is your focus?

In a joint discussion, we will be happy to advise you on the individual advantages and disadvantages of each process.

Use our contact form.

Lamination with OCA/PSA

Precise applications – with post-treatment if necessary – are the key to safe results in the lamination process. This prevents unwanted blistering and increases the adhesive strength. We offer PSA (Pressure-Sensitive Adhesives) for standard qualities, e.g., illuminated symbols. However, if your product has particularly high optical requirements, such as touch screens on flat glass substrates, we recommend the use of OCA (Optical Clear Adhesives).

Laminating touch sensors with Optical Clear Adhesive (OCA) provides the best attachment technique for touch screens with high optical quality. Our PolyIC sensors are ideally matched to this process: Their single-layer, thin film structure makes them easy to integrate into various display formats. No wonder, then, that lamination with OCA has become established as the standard method for display integration.

Functional Foil Bonding (FFB)

Unlike In-Mold Labeling, sensors are integrated in the FFB process outside of the injection molding. Our partner BAIER Prägetechnik has specially developed FFB machines for this purpose, which can automatically apply our PolyIC touch sensors. This makes Functional Foil Bonding ideally suited for retrofit sensor integration without adhesive into previously decorated plastic components. As a result, you remain more flexible in choosing your technical options: Would you rather replace the sensor button from your original design with a modern slider? No problem, FFB gives you the freedom right up to the last production step. And this also applies to series integrations! Discover all the benefits here.

Reinventing Touch Screen Integration

The lamination process is traditionally used for the integration of touch sensors. If you’re after more flexible, precise, and at the same time faster results, give FFB (Functional Foil Bonding) a try. This process revolutionizes sensor integration for components with complex geometries, such as those found in the automotive sector. Find out all there is to know about our FFB process for touchscreens here.



Your Advantages of FFB for Touch Screens:

  • For flat, curved, or lightly 3D shaped components
  • Mature process in series production
  • Lifting or unwinding procedure possible
  • Precise sensor placement possible with full automation
  • Adherent, stable connection with touch screens
  • Optimum adhesion during climate change test
  • Cost reduction through waste reducing post-mold process

In-Mold Electronics (IME)

Injecting a sensor via In-Mold Labeling (IML) enables you to perform a ‘one-shot process’ in which the component is sprayed together with the sensor label. If required, the decoration can even be directly integrated here – e.g., in the IMD process. The IML process for sensors is often referred to as IME (In-Mold Electronics). Here you can experience all the benefits of a fully integrated process.

IME integrates our sensors during the injection molding process with virtually no extra effort, saving both time and money. In the same process, components can also be upgraded with In-Mold Decoration (IMD). This opens up completely new, cost-efficient design options for electronic components. Find out more about the cost and sustainability benefits of In-Mold Electronics and In-Mold Decoration on our LEONHARD KURZ partner page.

Mechanical Fixation

Looking for a basic application to integrate our sensor foils? Then select mechanical fixation. This gives our ready-to-use PolyIC sensors a solid, lasting hold. Contact us for detailed information about this integration method.

Integration Procedure Comparison

Technical Aspects

 Lamination with PSA/OCAIn-Mold Electronics (IME)Functional Foil Bonding (FFB)
SubstrateGlass or plastic

Flat (2D) materials

Injection molded plastic

Flat or curved

Plastic material

Flat, curved or slightly 3D

ProcessLamination with adhesive on finished partsOne-step integration during injection molding and In-Mold DecorationPost mold process by hot stamping on preselected plastic parts
StabilityPossibility of bubbles due to degassing on plastic substrate by heatingNo bubble creation on plastic substrateNo bubble creation on plastic substrate

Economic Aspects

 Lamination with PSA/OCAIn-Mold Electronics (IME)Functional Foil Bonding (FFB)
InvestmentLamination machine, possible autoclaveAdjusted molding tool & machineFFB machine & tools
Possible automation degreeLimitedHighHigh
Adhesive costsPSA or OCA adhesive on sensor label neededPrimer as part of PolyTC® sensor label, no extra adhesive neededPrimer as part of PolyTC® sensor label, no extra adhesive needed
Integration, DecorationDownstream, on (decorated) finished partSingle-stage, combination with In-Mold Decoration (IMD) possibleDownstream, on (decorated) finished part; subsequent autoclave treatment possible
Integration conditionsHeat and pressure by stamping (vertical or roll-on)Heat and high pressure during injection molding processRoom temperature, low pressure
Critical yield aspectsOptical quality of lamination process (bubbles, wrinkles)Molded decoration defines yield of whole partNo yield loss by decoration scrap due to preselection


Are you wondering how to efficiently integrate sensor foils? Rely on our specialists and use our expert consulting service. PolyIC stands for decades of expertise in sensor integration issues. Write to us!

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